45 Percent Faster Throughput
Throughput is a determining factor in consumers’ satisfaction with 3G and 4G networks. They want access to calls, data, apps and more on their wireless devices anytime, anywhere – and fast.
Ethertronics’ New Air InteRFace Processing System™ technology speeds up wireless throughput by more than 45 percent, making it ideal for OEMs wanting to deliver high-performance wireless devices to consumers. As part of Ethertronics’ Active Antenna Systems Portfolio, this patented game-changing technology takes advantage of multipath fading to maximize both throughput and reliability in 3G and 4G (LTE and LTE-Advanced) cellular, as well as Wi-Fi devices.
Multiple Radiation Patterns from a Single Antenna Structure
By combining its patented Isolated Magnetic Dipole™ (IMD) antenna technology with its active antenna systems approach, Ethertronics is able to generate multiple radiation patterns from a single antenna structure. A patent-pending algorithm samples and switches between the radiation patterns, selecting the best one to use for the specific environment. As a result, the Air InteRFace Processing System technique can dynamically respond to changing RF conditions fast enough to minimize multipath fading and in turn increase both download speeds and connectivity.
Supports All Bands and Applications
A wide variety of bands and air interfaces are supported including 3G, 4G (LTE and LTE-Advanced) and WiFi. For all applications, the Air InteRFace Processing System enables device vendors to use performance and reliability to differentiate their infrastructure, smartphones, tablets and other devices, without the additional power consumption, space, design complexity, and cost associated with MIMO implementations.
In both office LANs and wide-area hotspot networks, the Air InteRFace Processing System technique can reduce CapEx and OpEx because a lower density of access points can still provide reliable coverage and high speeds.
For more in depth information on Ethertronics' Air InteRFace Processing System technology, please see the following White Paper: